Heat paste that pulls heat out of AI chips
| Why | Category | Data centers & chips |
|---|---|---|
| Level | Medium | |
| Use | Layer between chip and cold plate that conducts heat and stays soft | |
| What | Atoms | Filler + polymer contact 500–2k for heat-flow runs. B N Al O Si C H |
| How | Contact us for the design specs and build plan → | |
| Demo | Heat pulses cross the new filler faster than today’s paste | |
| Competition | Silicone pastes with boron nitride or alumina, liquid metal, indium | |
| Business | Buyers | Henkel, Dow, Shin-Etsu, Laird, server makers |
| Revenue | High License to TIM makers. ~$1–5M/yr | |